28nm – The Last Node of Moore's Law
A technology breakthrough allows the fabrication of semiconductor devices with multiple tiers of copper connected active devices utilizing conventional fab equipment. MonolithIC 3D Inc. offers solutions for logic and memory technologies, with significant benefits for cost, power and operating speed. The company believes in collaboration with existing players in the semiconductor industry.
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EventsMonolithic 3D: The Most Effective Path for Future IC Scaling | April 23rd, 2015
Join us at the "Monolithic 3D: The Most Effective Path for Future IC Scaling" Webcast. Zvi Or-Bach, founder President and CEO of MonolithIC 3D™ Inc. will be among the speakers at the webcast. "The industry is now looking at monolithic 3D to be the future technology driver." Register here. 2015 CMOS Emerging Technologies Research Conference | May 20th thru 22nd, 2015, in Vancouver, Canada
Join us at the 2015 CMOS Emerging Technologies Research Conference on May 20th thru 22nd, 2015 in Vancouver, Canada. MonolithIC 3D Inc.'s members are invited to give a presentation on our technology. The paper is entitled: 'Monolithic 3D Technology: Keeping Alive Transistor Economic Scaling, and Current Applications' and will be presented by Brian Cronquist, VP of Technology and IP of MonolithIC3D Inc. Our presentation will be held in in Session R3 (3D Integration and Packaging), on May 21nd. 2015 IEEE S3S Conference | October 5th thru 8th, 2015, in Sonoma Valley, CA
Join us at the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference on October 5th thru 8th, 2015 in Sonoma Valley, CA. Zvi Or-Bach, President and CEO of MonolithIC 3D Inc. is the 3D Chair of the Conference. |